Cov yam ntxwv tseem ceeb

High thermal conductivity rau ceev thiab sib xws thaum tshav kub kis
Zoo heev dimensional stability thiab nto flatness
Cov ntaub ntawv zoo: tooj liab, tooj liab-tungsten composites, thiab cov khoom siv PM alloys
Ze ntawm -net-puab tsim rau micro-fins, qhov, thiab nyias phab ntsa
Kev ntseeg siab hauv cov qauv tsim qauv compact thiab thermal cycling

Tus nqi -ntau ntau lawm nrog txo machining thiab cov khoom poob
Optimized rau QSFP, QSFP-DD, OSFP, thiab CFP series optical modules
PM/MIM kom zoo dua qub machining: meej, complex, scalable, thiab uniform

Txheej txheem cej luam

NEWLIFE Optical Transceiver Thaum tshav kub kub Spreaders yog siab -kev ua haujlwm thermal tswj kev daws teeb meem engineered rau siab -speed optical modules, xws li QSFP, QSFP-DD, OSFP, thiab CFP series. Modern data center and telecom environments require optical modules to operate at high density with elevated power, which generates significant heat within compact packages. Cov khoom siv hluav taws xob no muab cov cua sov sai thiab tsis sib xws, ua kom muaj kev ruaj ntseg, txo qis thermal drift, thiab ntev - lub sij hawm cia siab rau siab - qhov sib txuas lus kho qhov muag.

Tsim los ntawm NEWLIFE tus tswv hmoov hlau metallurgy (PM) thiab Hlau Txhaj Moulding (MIM) thev naus laus zis, cov khoom siv hluav taws xob no ua tiav nyob ze -net-cov duab geometries, nruj qhov ntev ntev, thiab qhov tshwj xeeb nto tiav. Kev ua PM/MIM tso cai rau kev ua haujlwm ntawm micro-fins, nyias- phab ntsa cov qauv, thiab cov channel sab hauv uas nyuaj los yog tsis tuaj yeem ua tiav nrog cov tsoos machining, extrusion, lossis tuag- cov txheej txheem casting. Txoj hauv kev no txo qis kev tshaj tawm - ua tiav, txo cov khoom pov tseg, thiab muab tus nqi- ua kom muaj txiaj ntsig zoo rau kev tsim khoom siab - ntim.

NEWLIFE tus kheej- tsim cov hmoov ua kom zoo thermal conductivity, coefficient ntawm thermal expansion (CTE), thiab txhua yam muaj zog, tso cai rau tsim optimization rau txawv module hom thiab kev khiav hauj lwm tej yam kev mob. The combination of high-density metals with uniform microstructure ensures mechanical rigidity, soldering compatibility, and resistance to warpage, which is crucial for compact pluggable modules that experience repeated insertion cycles and thermal stresses.

Los ntawm kev sib piv, cov pa machined tooj liab los yog tuag- nrum hlau tshav kub kis feem ntau yuav tsum tau nthuav dav ncej- ua kom ua tau kom nruj tolerances, ua rau cov khoom pov tseg ntau dua, thiab muaj kev txwv nyob rau hauv realizing complex duab thiab zoo nta. NEWLIFE PM/MIM spreaders outperforms ib txwm Cheebtsam nyob rau hauv thermal kev ua tau zoo, manufacturability, thiab nqi -efficiency thaum txhawb miniaturized siab- transceivers ceev txog li 800G.