Ntsiab nta

High thermal efficiency

Copper lub hauv paus thermal conductivity tso cai rau kev hloov pauv sai sai ntawm cov khoom rhiab xws li laser chips thiab photodiodes. Qhov no txo cov thermal tsis kam thiab ua kom ruaj khov ntsuas kub thaum lub sijhawm ua haujlwm tas mus li lossis ua haujlwm.

Mechanical Strength nyob rau hauv Thermal Stress

Tungsten's siab modulus thiab qis thermal expansion muab cov qauv kev txhawb zog, tiv thaiv deformation, warping, los yog tawg nyob rau hauv rov qab thermal cycling. Qhov robustness no ua rau lub dab dej kub zoo tagnrho rau ntev - lub sij hawm siab - cov ntawv siv fais fab.

Precision Manufacturing Los ntawm MIM

MIM ua rau ze rau -net- cov duab tsim ntawm cov geometry nyuaj xws li micro-channels, asymmetric bases, thiab zoo mounting nta. Piv rau CNC machining, MIM muaj:

Siab dua dimensional repeatability
Kev siv cov khoom siv zoo tshaj
Tsawg tus nqi tsim khoom rau nruab nrab mus rau qhov ntim loj
Muaj peev xwm tsim tau nyias- phab ntsa thiab cov qauv compact yam tsis muaj kev cuam tshuam cov tshuab

Ntev - Lub Sijhawm Kev Ntseeg

Lub tungsten- qauv tooj liab pom tias tsis tshua muaj thermal qaug zog, oxidation tsis kam, thiab ruaj khov thermal conductivity dhau lub neej ua haujlwm ntev, ua kom muaj kev vam meej nyob rau tom ntej - tiam kev sib txuas lus kho qhov muag.

Txheej txheem cej luam

NEWLIFE Tungsten Copper Heat Sink yog tsim los rau cov ntawv thov uas xav tau siab -kev ua haujlwm thermal tswj tsis pub dhau lub tshuab kho qhov muag thiab photonic. Los ntawm kev sib txuas ntawm tungsten lub siab melting point thiab txhua yam muaj zog nrog cov thermal conductivity zoo heev ntawm tooj liab, cov khoom sib xyaw no muab cov cua kub zoo tshaj plaws thiab kev ruaj ntseg ntawm cov qauv.

Using advanced Metal Injection Molding (MIM) technology, NEWLIFE produces heat sinks with uniform density, fine microstructure, and complex geometries that would be difficult or cost-prohibitive to achieve through conventional machining. Peb tus kheej-tsim tungsten thiab tooj liab hmoov ua kom ruaj khov sintering cwj pwm, zoo ib yam shrinkage, thiab siab bonding zoo ntawm cov hlau theem, ua kom ntseeg tau kev ua tau zoo nyob rau hauv siab - lub hwj chim kho qhov muag cav thiab precision semiconductor modules.

Daim ntawv thov

Optical Ntim:Thaum tshav kub kub tswj rau LDs, photodiodes, optical transceivers, thiab siab - kis tau tus mob modules.
Lub zog Electronics:Thermal dissipation for MOSFETs, IGBTs, thiab high -power driver circuits.
Photonics:Thermal tswj rau siab -kev ua tau zoo photonic integrated circuits thiab laser modules.
Cov khoom siv semiconductor:Precision thermal interfaces rau kev soj ntsuam fixtures thiab siab - ntim ntim platforms.