Siab -Density W–Cu Thaum tshav kub kub kis substrates rau fais fab & RF Devices
Cov yam ntxwv tseem ceeb
- High Thermal conductivity:Tshaj tawm sai sai ntawm cov khoom siv hluav taws xob los tiv thaiv hotspots.
- CTE tsim:Matches Si, GaN, GaAs, los yog SiC kom txo cov thermal stress.
- Siab -Tsub stability:Tswj kev ua haujlwm raws li kev ua haujlwm siab - lub zog txuas ntxiv.
- Dimensional raug:Kev ua haujlwm PM ua kom muaj kev tiv thaiv nruj thiab kev ua tsov rog tsawg.
- Nto Compatibility:Haum rau Ni / Au plating, soldering, thiab ncaj qha kev sib txuas.
- Hermetic Pob Kev Ntseeg:Txhawb lub hauv paus ruaj khov rau hermetic enclosures.
- PM vs. Traditional processing:Ua haujlwm zoo milling lossis casting rau ntom W-Cu los ntawm kev txo cov machining, seem, thiab thermal distortion thaum ua kom cov geometries nyuaj.
Txheej txheem cej luam
NEWLIFE Tungsten-Copper (W–Cu) Thermal Substrates yog precision-engineered solutions rau siab -lub hwj chim semiconductor ntim, RF modules, thiab siab -kev ua tau zoo LED thiab laser puag. Cov substrates no xa cov hluav taws xob sib kis tau zoo, tsis muaj thermal tsis kam, thiab tswj coefficient ntawm thermal expansion (CTE) haum rau cov khoom siv semiconductor xws li Si, GaN, GaAs, thiab SiC.
Manufactured via Powder Metallurgy (PM) and sintering–infiltration, NEWLIFE W–Cu substrates offer high density, uniform microstructure, and excellent dimensional stability under repeated thermal cycling. Tsis zoo li cov pa machining lossis tuag-casting, PM ua rau ze rau -net-puab tsim cov phaj nyuaj, blocks, thiab cov cua kub sib kis, txo cov khoom pov tseg, lub sijhawm ua haujlwm, thiab cov kev ntxhov siab nyob hauv siab - ntom W-Cu composites. NEWLIFE's proprietary hmoov ua kom paub tseeb tias sintering tus cwj pwm, superior purity, thiab zoo thermal ua hauj lwm nyob rau hauv lub substrate.
Kev sib xyaw ua ke ntawm cov neeg kho tshuab siab, thermal conductivity, thiab tailored CTE ua rau cov substrates no zoo tagnrho rau precision hluav taws xob sib dhos uas thermal tswj thiab kev ntseeg tau ntawm cov qauv tseem ceeb.
Daim ntawv thov
- Lub zog Semiconductor Modules:IGBT, MOSFET, SiC/GaN li.
- RF thiab Microwave Systems:Ua tau zoo substrates rau siab - cov khoom siv zaus.
- High-Power LED thiab Laser Bases:Thermal stability rau optical modules.
- Hermetically Sealed Packages:Bases rau aerospace, tiv thaiv, thiab industrial electronics.
- Precision Electronics:Siab - kev ntseeg siab los ua ke yuav tsum tau ua kom muaj cua sov thiab kev ua haujlwm zoo.
Cim npe nrov: Tuam Tshoj tungsten tooj liab thermal substrate manufacturers, lwm tus neeg
